What is the difference between “random orientation” and a specific orientation (C-axis is not always the best, A-plane is actually easier to grind and polish, etc.).

The Random is material without any orientation. But Random may be and C- plane, A- plane and other.

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What is the difference between “random orientation” and a specific orientation (C-axis is not always the best, A-plane is actually easier to grind and polish, etc.).
I have been polishing c-plane sapphire using alumina slurry and have been getting around 12 um/hr removal rate. I am trying now to polish A plane sapphire, but my removal rate dropped considerably to less than 4 um/hr? Do the A plane and C plane polish differently?